Evolution of Copper Microstructure Subjected to Combined Twisting and Drawing Technology
Volokitin A.V. Fedorova T.D. Denissova A.I.
February 2024G.V. Kurdyumov Institute for Metal Physics of N.A.S. of Ukraine
Metallofizika i Noveishie Tekhnologii
2024#46Issue 2121 - 128 pp.
This work studies evolution of copper microstructure during a combined deformation process. The essence of this process is in deformation of copper wire in a rotating equal-channel stepped matrix with subsequent drawing. Deformed wire is examined using transmission electron microscopy and EBSD analysis. After three cycles of deformation, an ultrafine-grained gradient microstructure with a high component of high-angle grain boundaries is obtained.
copper , drawing , microstructure , twisting , wire
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