Thermal conductivity and mechanical performance of hexagonal boron nitride nanosheets-based epoxy adhesives
Wang S. Xue H. Araby S. Demiral M. Han S. Cui C. Zhang R. Meng Q.
27 August 2021IOP Publishing Ltd
Nanotechnology
2021#32Issue 35
Thermosets possess diverse physical and chemical properties and thus they are widely used in various applications such as electronic packaging, construction, and automotive industries. However, their poor thermal conductivity and weak mechanical performance jeopardize their continual spread in modern industry. In this study, boron nitride nanosheets (BNNSs) were employed to promote both mechanical and thermal properties of epoxy nanocomposites. BNNSs and their epoxy nanocomposites were fabricated using in situ solvent ultrasonication and in situ polymerization, respectively. Thermal conductivity was enhanced by 153% increment in epoxy/BNNS nanocomposite at 7 wt% in comparison with neat epoxy. In parallel, Youngs modulus, lap shear strength, fracture toughness (K 1C ) and energy release rate (G 1C ) increased by 69%, 31%, 122% and 118%, respectively at 1 wt% BNNSs. Moreover, fatigue life and strength of lap shear joints were significantly improved upon adding BNNSs. A numerical model of the single lap shear joint was developed to validate the accuracy of the material constants obtained. Epoxy/BNNS nanocomposites exhibited an outstanding mechanical performance as well as high thermal conductivity giving them merits to widen their applications in electronic and automotive industry.
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School of Mechanical Engineering, Northwestern Polytechnical University, Xian, 710072, China
College of Aerospace Engineering, Shenyang Aerospace University, Shenyang, 110136, China
School of Engineering and Digital Sciences, Nazarbayev University, Nur-Sultan, 010000, Kazakhstan
College of Engineering and Technology, American University of the Middle East, Kuwait
Shenyang Aircraft Design Institute, Shenyang, China
School of Mechanical Engineering
College of Aerospace Engineering
School of Engineering and Digital Sciences
College of Engineering and Technology
Shenyang Aircraft Design Institute
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