Thin-film deposition by combining plasma jet with spark discharge source at atmospheric pressure
Ussenov Y.A. Toktamyssova M.T. Dosbolayev M.K. Gabdullin M.T. Daniyarov T.T. Ramazanov T.S.
March 2021Wiley-VCH Verlag
Contributions to Plasma Physics
2021#61Issue 3
This study demonstrates a method for the deposition of CuOx thin films by combining atmospheric pressure plasma jet with spark discharge. In this type of discharge source, the bulk copper material of spark discharge electrodes plays the role of a precursor. Copper atoms and particles go through the physical processes of sputtering, evaporation, and further agglomeration and condensation in the plasma jet and on the substrate. The experiments were carried out with and without a combination of discharges. The material coated on the substrate was studied using a scanning electron microscope, Raman spectroscopy, and energy-dispersive X-ray spectroscopy. The characteristics of the set-up and plasma, such as I-V curves, optical emission spectra, and substrate temperature, were also measured. Copper electrodes were examined for erosion by a scanning electron microscope. The results demonstrate that deposits coated by combined discharge show denser and thicker films.
atmospheric pressure plasma jet , dielectric barrier discharge , low-temperature atmospheric-pressure plasma , spark discharge , thin film deposition
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NNLOT, Faculty of Physics and Technology, Al-Farabi Kazakh National University, Almaty, Kazakhstan
Institute of Applied Science and Information Technologies, Almaty, Kazakhstan
IETP, Faculty of Physics and Technology, Al-Farabi Kazakh National University, Almaty, Kazakhstan
NNLOT
Institute of Applied Science and Information Technologies
IETP
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