Fabrication of AA2024/SiCp Metal Matrix Composite by Mechanical Alloying
Rofman O.V. Prosviryakov A.S. Kotov A.D. Bazlov A.I. Milovich P.O. Karunakaran G. Mikhaylovskaya A.V.
March 2022Korean Institute of Metals and Materials
Metals and Materials International
2022#28Issue 3811 - 822 pp.
Abstract: Mechanical alloying is a widely used alternative to the liquid-phase method of embedding reinforcements to manufacture metal matrix composites (MMC). In this research, high-energy ball milling was used to distribute various volume fractions of sub-micron-sized SiCp particles (2, 10, and 20 vol%) in AA2024 aluminum powder alloy, focusing on powder morphology and milling conditions. An increase in the full width at half-maximum and the shifting of peaks at higher angles were observed after mechanical alloying. These examinations were attributed to changes in the lattice parameters of the matrix alloy. It was noted that the temperature and loading pressure during the die compaction stages of MMC powders directly affect the compact density, whereas the volume fraction of SiCp changes hardness. Compression testing, conducted at elevated temperatures to evaluate the plastic properties of the material, showed sufficient ductility characteristics for thermomechanical processing. Graphic Abstract: [Figure not available: see fulltext.].
Aluminum alloys , Compression testing , Mechanical alloying , Metal matrix composites , Powder compaction
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Laboratory of Radiation Materials Science, Institute of Nuclear Physics, Almaty, 050032, Kazakhstan
Department of Physical Metallurgy of Non-Ferrous Metals, National University of Science and Technology MISiS, Moscow, 119049, Russian Federation
Department of Semiconductor Electronics and Semiconductor Physics, National University of Science and Technology MISiS, Moscow, 119049, Russian Federation
Department of Fine Chemistry, Biosensor Research Institute, Seoul National University of Science and Technology (Seoul Tech), Seoul, 01811, South Korea
Laboratory of Radiation Materials Science
Department of Physical Metallurgy of Non-Ferrous Metals
Department of Semiconductor Electronics and Semiconductor Physics
Department of Fine Chemistry
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